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Taking the Broad View
Presentations from Underwriters Laboratories, iNEMI and IPC’s Roadmap committee on Thursday carried a couple common threads. These IPC APEX EXPO® sessions stressed the importance of working together...
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System in Package Continues to Rise
Whether it’s called chip stacking, 3-D packaging or package on package (PoP), this system in package concept is extremely likely to be part of the future for many board and EMS companies over the next...
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Holistic Design Takes Hold
Sometimes, it’s pretty easy to spot design trends. The one I’m hearing a lot about lately is holistic design. A couple years ago, it seemed like whenever I interviewed anyone in the transportation...
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Satellite Trade-offs Require a Broad View
Electronics in the defense industry continue to evolve as designers find different ways to trade cost and performance in one part of a system versus another. These trade-offs continue to occur in...
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Automakers Look Beyond Modeling and Simulation
The auto industry’s blend of high volumes, high reliability and low costs makes it a harbinger of trends. A show like the SAE World Congress attracts a lot of technical people, ranging from CEOs to...
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Transition to Handhelds Impacts Business, Technology Strategies
We’ve been in a period called the post-PC era for several years, yet there’s still an ongoing transition to new devices. Smart phones, Tablets and Netbooks are seeing spectacular growth while sales of...
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IPC Electronics Systems Technology Conference (IPC ESTC) Leads off with...
Dr. Tin-Lup Wong, distinguished engineer and executive director for Lenovo got IPC ESTC in Las Vegas off to a great start. Dr. Wong gave a keynote presentation that provided attendees an outstanding...
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